JINJIA utilizes a CCD positioning system for its full lamination process, ensuring a high bonding yield. Optical bonding technology is extensively employed across various industries and sectors, including wearable devices, handheld POS systems, smart tablets, human-machine interfaces, smart home applications, new media, medical equipment, and industrial control systems. Optical bonding products significantly minimize light reflection and transmitted light loss, thereby enhancing brightness and improving display quality. Additionally, this technology effectively isolates dust and moisture, reduces noise interference, enables a slimmer device profile, facilitates narrow bezel design, and simplifies the assembly process.

Bonding size: 0.9” ~ 86”

Scope of application:

Cover Lens + LCD Module

CTP + LCD Module

RTP + LCD Module

TFT with thick iron frame，3D, curved, round and other modules of different shapes can be bonded

Cover Lens material include: Glass, PMMA, PC, PET, etc.

LCD Module include: TFT, Mono LCD, OLED, E-Ink display